Japanese
English Outline
Chinese Outline
Korean Outline
2005 number of visitor
The log mark of JPCA Show can be downloaded
The information of the traffic access to the exhibition hall
Sitemap
Click here for any inquires about exhibition
To view a PDF file, Adobe Reader is required.
Inquiry Japan Printed Circuit Association
TOP > Information of Exhibitors > Exghibitor's Information |Booth map (5.7MB)



You can search the exhibitors from the first letter of Exhibitor's name

| A | B | C | D | E | F | G | H | I | J | K | L | M |
| N | O | P | Q | R | S | T | U | V | W | X | Y | Z |


You can find the exhibitors from each Exhibition Name

2005 PWB Technology Expo Products Category
2005 FPC Expo Products Category
2005 DES(Design and manufacturing Engineering Solution) Expo Products Category
2005 MicroTEST Products Category
2005 Microelectronics Show Products Category
Catalog Exhibition


You can search the exhibitors from each Main Handling Product

2005 PWB Technology Expo Products Category
P001 Rigid Electronic Board (Sigle/Double/Multilayer)
P002 Flex Rigid Board
P003 Sectional Process(es) of Electronic Board Manufacturing
P004 Base Materials for Rigid Electronic Board
P005 Equipment & Materials for ArtWork Generation, PhotoTooling for Manufacturing PWB
P006 Equipment & Materials for Mechanical Processes for Manufacturing PWB
P007 Equipment & Materials for Laminating Processes for Manufacturing PWB
P008 Equipment & Materials for Surface Finishing/Cleaning/Treatment Processes for Manufacturing PWB
P009 Equipment & Materials for Plating Processes(Panel/Pattern/Contact Plating etc.) for Manufacturing PWB
P010 Equipment & Materials for Imaging Processes for Manufacturing PWB
P011 Equipment & Materials for Etching Processes and Resist Removal Processes of Manufacturing PWB
P012 Equipment & Materials for Solder Application and Finishing Processes Processes for Manufacturing PWB
P013 Equipment and Materials for Electronic Board Manufacturing Process (Die Fablication, etc.)
P014 Equipment for Manufacturing
P015 Environmental Control and Recycle Equipment and Maintenance Facilities
P016 Rigid PWB Technology related Pulications, Information, Services
2005 FPC Expo Products Category
F001 Flexible Electronic Board(Sigle/Double/Multilayer/Buid-up)
F002 TAB/COF/TCP
F003 Base Materials for Flexible Electronic Board(Tape/Film Materials and Copper Foils)
F004 Applications Products used by FPCs(FPD Module, Drive Module, etc.)
F005 Equipment & Materials for Mechanical Processes for Manufacturing FPC/TAB/COF/TCP
F006 Equipment & Materials for Laminating Processes for Manufacturing FPC/TAB/COF/TCP
F007 Equipment & Materials for Surface Finishing/Cleaning/Treatment Processes for Manufacturing FPC/TAB/COF/TCP
F008 Equipment & Materials for Imaging Processes for Manufacturing FPC/TAB/COF/TCP
F009 Puncing/Cutting machines for Manufacturing FPC/TAB/COF/TCP
F010 Equipment & Materials for Die Fabrication for Manufacturing FPC/TAB/COF/TCP
F011 Miscellaneous Equipment and Materials for Manufacuturing FPC/TAB/COF/TCP
F012 Equipment for Manufacturing FPC/TAB/COF/TCP
F013 Environmental Control and Recycle Equipment and Maintenance Facilities
F014 FPC Technology realted Publications, Information, Services
2005 DES(Design and manufacturing Engineering Solution) Expo Products Category
D001 Application Software
D002 Electronic Circuits Design
D003 System Consultation Service
D004 EMS/ODM
D005 Communication Network Solution
D006 CAE Tools (CAD/CAM/CIM)
D007 Product Design Technology
D008 Case Design
D009 Model Development System for Trial Manufacture
D010 Molding
D011 Rapid Prototyping System
D012 DES related Publicatioins, Information, Services, etc.
2005 MicroTEST Products Category
T001 Automatic Optical Inspection Equipment
T002 X-ray Inspection Equipment
T003 Evaluation Systems
T004 Tester
T005 Special Tools for Testing and Measuring/Inspection System
T006 2D/3D Measuring Equipment
T007 Measuring Instruments
T008 Analyzers
T009 Test/Inspection Business
T010 Sensing Imaging Technology Systems
T011 Virtual Reality technology
T012 MicroTEST related Publications, Information, Serivces
2005 Microelectronics Show Products Category
M001 Products with High-density/High-frequency electronics packaging technologies
M002 High-density Substrates/Interpozers
M003 IC Packages( including Sustem in Package)
M004 Electronic Components
M005 Embedded Packaging Board
M006 Wafer Process (including materials)
M007 Display Device/Optical Device
M008 Thick Film and Thin Film Materials(inluding paste material)
M009 Materials related to Interconnection
M010 Materials realated to Electronics Packaging(including Solders,Lead-free solder,Anisotropic Conductive, etc)
M011 Bonding/Mounting /Dispenser/Past Printing Machines
M012 Equipment for manufacturing
M013 Environmental Consideration Technologies, Recycle System
M014 Electronic Packaging (Jisso) related Pulications, Information, Services